Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages

dc.contributor.author	Vandevelde, Bart
dc.contributor.author	Gonzalez, Mario
dc.contributor.author	Beyne, Eric
dc.contributor.author	Vandepitte, D.
dc.contributor.author	Baelmans, M.
dc.contributor.imecauthor	Vandevelde, Bart
dc.contributor.imecauthor	Gonzalez, Mario
dc.contributor.imecauthor	Beyne, Eric
dc.contributor.orcidimec	Vandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimec	Beyne, Eric::0000-0002-3096-050X
dc.date.accessioned	2021-10-15T17:26:15Z
dc.date.available	2021-10-15T17:26:15Z
dc.date.issued	2004
dc.identifier.uri	https://imec-publications.be/handle/20.500.12860/9829
dc.source.beginpage	65
dc.source.conference	Proceedings European Microelectronics Packaging Symposium (IMAPS Europe)
dc.source.conferencedate	16/06/2004
dc.source.conferencelocation	Prague Czech Republic
dc.source.endpage	70
dc.title	Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
dc.type	Proceedings paper
dspace.entity.type	Publication
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