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Conference contributions
Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
Publication:
Influence of printed circuit board properties on solder joint fatigue life of assembled IC packages
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Date
2004
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Vandevelde, Bart
;
Gonzalez, Mario
;
Beyne, Eric
;
Vandepitte, D.
;
Baelmans, M.
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1888
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Acq. date: 2025-12-10
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Metrics
Views
1888
since deposited on 2021-10-15
1
last month
Acq. date: 2025-12-10
Citations