Browsing by author "Judelewicz, Moshe"
Now showing items 1-5 of 5
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Al speed fill
Beyer, Gerald; Maex, Karen; Daniels, Stephen; Lee, S.; Proost, Joris; Bender, Hugo; Judelewicz, Moshe; Maity, Nirmalya (1999) -
Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
Brongersma, Sywert; Vervoort, Iwan; Judelewicz, Moshe; Bender, Hugo; Conard, Thierry; Vandervorst, Wilfried; Beyer, Gerald; Richard, Emmanuel; Palmans, Roger; Lagrange, Sébastien; Maex, Karen (1999) -
Process integration induced thermodesorption from SiO2/SiLK resin dielectric based interconnects
Baklanov, Mikhaïl; Muroyama, M.; Judelewicz, Moshe; Kondoh, Eiichi; Li, H.; Waeterloos, Joost; Vanhaelemeersch, Serge; Maex, Karen (1999) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (2000) -
Self-annealing characterization of electroplated copper films
Lagrange, Sébastien; Brongersma, Sywert; Judelewicz, Moshe; Saerens, Annelies; Vervoort, Iwan; Richard, Emmanuel; Palmans, Roger; Maex, Karen (1999)