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Conference contributions
Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
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Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper
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Date
1999
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Brongersma, Sywert
;
Vervoort, Iwan
;
Judelewicz, Moshe
;
Bender, Hugo
;
Conard, Thierry
;
Vandervorst, Wilfried
;
Beyer, Gerald
;
Richard, Emmanuel
;
Palmans, Roger
;
Lagrange, Sébastien
;
Maex, Karen
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1968
since deposited on 2021-10-06
1
last month
Acq. date: 2026-01-10
Citations
Metrics
Views
1968
since deposited on 2021-10-06
1
last month
Acq. date: 2026-01-10
Citations