Publication:

Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper

Date

1999
Proceedings Paper
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dc.contributor.authorBrongersma, Sywert
dc.contributor.authorVervoort, Iwan
dc.contributor.authorJudelewicz, Moshe
dc.contributor.authorBender, Hugo
dc.contributor.authorConard, Thierry
dc.contributor.authorVandervorst, Wilfried
dc.contributor.authorBeyer, Gerald
dc.contributor.authorRichard, Emmanuel
dc.contributor.authorPalmans, Roger
dc.contributor.authorLagrange, Sébastien
dc.contributor.authorMaex, Karen
dc.contributor.imecauthorBrongersma, Sywert
dc.contributor.imecauthorBender, Hugo
dc.contributor.imecauthorConard, Thierry
dc.contributor.imecauthorVandervorst, Wilfried
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorMaex, Karen
dc.contributor.orcidimecBrongersma, Sywert::0000-0002-1755-3897
dc.contributor.orcidimecConard, Thierry::0000-0002-4298-5851
dc.date.accessioned2021-10-06T10:46:25Z
dc.date.available2021-10-06T10:46:25Z
dc.date.issued1999
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3280
dc.source.beginpage290
dc.source.conferenceProceedings of the International Interconnect Technology Conference - IITC; San Francisco, CA, USA.
dc.source.endpage292
dc.title

Non-correlated behavior of sheet resistance and stress during self-annealing of electroplated copper

dc.typeProceedings paper
dspace.entity.typePublication
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