Browsing by author "Oba, Yoshiyuki"
Now showing items 1-4 of 4
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Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2014) -
Effect of test structure on electromigration characteristics in 3D-TSV stacked devices
Oba, Yoshiyuki; De Messemaeker, Joke; Tyrovouzi, Anna-Maria; Miyamori, Yuichi; De Vos, Joeri; Wang, Teng; Beyer, Gerald; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2015) -
Hydrogen outgassing induced liner barrier reliability degradation in through silicon via's
Li, Yunlong; Oba, Yoshiyuki; Wu, Chen; Van Huylenbroeck, Stefaan; Van Besien, Els; Vereecke, Guy; Stucchi, Michele; De Wolf, Ingrid; Beyer, Gerald; Beyne, Eric; Croes, Kristof (2014) -
Impact of barrier integrity on liner reliability in 3D through silicon vias
Li, Yunlong; Civale, Yann; Oba, Yoshiyuki; Cockburn, Andrew; Park, Jin Hee; Beyne, Eric; De Wolf, Ingrid; Croes, Kristof (2013)