Browsing by author "Corlatan, D."
Now showing items 1-16 of 16
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Experimental investigation of currents and efficiencies in SrS:Ce thin-film electroluminescent devices
Neyts, K.; Corlatan, D.; De Visschere, K.; Lahonen, M.; Viljanen, J. (1997) -
Experimental validation of a star-shaped thermal compact model for underfilled flip chip assemblies
Driessens, Evelien; Vandevelde, Bart; Beyne, Eric; Corlatan, D.; Roose, E. (2002) -
Field dependence of the cross-section for excitation of Ho and Mn in ZnS based electroluminescent devices
Corlatan, D.; Neyts, K.; Van den Bossche, P.; De Visschere, Patrick; Soenen, B. (1997) -
HIPERPRINT= a board technology for high-frequency applications
De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Corlatan, D.; Raedschelders, E.; Patra, G.; Morrell, M.; Haley, C.; Schols, G.; Ostmann, A.; Mathelin, D. (2000) -
Mixed component integration in advanced printed wiring boards
O'Reilly, S.; Duffy, M.; Mathuna, S. C.; Raedschelders, E.; Corlatan, D.; Madou, An; Martens, Luc; Payne, S. (1999) -
Mixed component integration in MCM-L technology
O'Reilly, S.; Duffy, M.; Mathuna, S. C.; Madou, An; Martens, Luc; Corlatan, D.; Raedschelders, E.; De Langhe, Pascal; Langkabel, E. (1999) -
Modified micro-macro thermo-mechanical modelling of ceramic ball grid array packages
Vandevelde, Bart; Degryse, Dominiek; Beyne, Eric; Roose, E.; Corlatan, D.; Swaelen, G.; Willems, G.; Christiaens, F.; Vandepitte, D.; Baelmans, M. (2003) -
Parametric compact models for flip chip assemblies
Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D. (1999) -
Parametric compact models for flip chip assemblies
Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D. (2000) -
Photovia technology: some important aspects for reliability
Zhang, S.; De Baets, J.; Van Calster, Andre; Corlatan, D.; De Langhe, Pascal; Allaert, K. (1999) -
Properties of charge carriers in ZnS and their effect on the excitation of Mn
Corlatan, D.; Neyts, K.; De Visschere, Patrick; Van den Bossche, Johan; Soenen, B. (1997) -
Simulation and measurement of multiplication in thin film electroluminescent devices with doped probe layers
Neyts, K.; Corlatan, D. (1998) -
Simulation of solder joint reliability for CBGA packages
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Roose, Erik; Corlatan, D. (2001) -
Standard SMT process for flip-chip assembly on FR4 substrate
Harris, S.; Patra, G.; Mainwaring, S.; Schols, G.; Mathelin, D.; Corlatan, D.; Raedschelders, E.; De Langhe, Pascal; De Baets, Johan; Vereeken, Maria; Van Calster, Andre; Morrell, M; Haley, C.; Ostman, A. (2001) -
UV induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers
Neyts, K.; Corlatan, D. (1998) -
UV-induced charge transfer and light emission in ZnS based electroluminescent devices with probe layers
Neyts, K.; Corlatan, D. (1996)