Parametric compact models for flip chip assemblies

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Authors

Van Dooren, Sofie; Vandevelde, Bart; Beyne, Eric; Christiaens, Filip; Corlatan, D.

Issue

3

Journal

IEEE Trans. Components and Packaging Technologies

Volume

23

Title

Parametric compact models for flip chip assemblies

Publication type

Journal article

Embargo date

9999-12-31

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