Browsing by author "Sood, Sumant"
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300mm wafer thinning and backside passivation compatibility with temporary wafer bonding for 3D stacked IC applications
Jourdain, Anne; Buisson, Thibault; Phommahaxay, Alain; Privett, Marc; Wallace, Daniel; Sood, Sumant; Bisson, Peter; Beyne, Eric; Travaly, Youssef; Swinnen, Bart (2010-11) -
A study of microbump metrology and defectivity at 20m pitch and below for 3D TSV stacking
Miller, Andy; Haensel, Leander; Vandeweyer, Tom; Beyne, Eric; Wiesiollek, Markus; Eisenbach, Heiko; Filzen, Marc; Wen, Youxian; Sood, Sumant (2015) -
Cu to Cu interconnect using 3D-TSV and wafer to wafer thermo-compression bonding
Huyghebaert, Cedric; Van Olmen, Jan; Civale, Yann; Phommahaxay, Alain; Jourdain, Anne; Sood, Sumant; Farrens, Shari; Soussan, Philippe (2010)