Browsing by author "Chen, Jian"
Now showing items 1-15 of 15
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Bonding on Cu: a new stress evaluation approach by Raman spectroscopy
Chen, Jian; Ho, Meng; Lam, Kan Wai; Ratchev, Petar; Stoukatch, Serguei; Beyne, Eric; Vath, C.J.; De Wolf, Ingrid (2002) -
High resolution stress and temperature measurements in semiconductor devices using micro-Raman spectroscopy
De Wolf, Ingrid; Chen, Jian; Rasras, Mahmoud; van Spengen, Merlijn; Simons, Veerle (1999) -
Infrared interface analysis of high-k dielectrics deposited by atomic layer chemical vapour deposition
Cosnier, Vincent; Bender, Hugo; Caymax, Matty; Chen, Jian; Conard, Thierry; Nohira, Hiroshi; Richard, Olivier; Tsai, Wilman; Vandervorst, Wilfried; Young, Edward; Zhao, Chao; De Gendt, Stefan; Heyns, Marc; Maes, Jos; Tuominen, Marko; Rochat, N.; Olivier, M.; Chabli, A. (2001) -
Integration issues of polysilicon with high k dielectrics deposited by Atomic Layer Chemical Vapor Deposition
Tsai, Wilman; Chen, Jian; Carter, Richard; Cartier, Eduard; Kluth, Jon; Richard, Olivier; Claes, Martine; Lin, Steven; Nohira, Hiroshi; Conard, Thierry; Caymax, Matty; Young, Edward; Vandervorst, Wilfried; De Gendt, Stefan; Heyns, Marc; Manabe, Yukiko; Maes, Jan; Rittersma, Chris; Besling, Wim; Roozeboom, F. (2002) -
Local stress analysis on polymer sud grid array (PSGA) packages by raman spectroscopy and FEM simulation
Chen, Jian; Vandevelde, Bart; De Wolf, Ingrid; Van Puymbroeck, Jan; Heerman, M. (2001) -
Local stress measurements in packaging by Raman spectroscopy
Chen, Jian; Chan, M.; De Wolf, Ingrid (2000) -
Mechanical issues of Cu to Cu wire bonding
Chen, Jian; Degryse, Dominiek; Ratchev, Petar; De Wolf, Ingrid (2004-09) -
Micro-Raman spectroscopy study of the mechanical stress induced by BGA-assembly and validation by FEM
Chen, Jian; De Wolf, Ingrid; Chan, M. (2001) -
Physical characterization of high-k gate stacks deposited on HF-last surfaces
Bender, Hugo; Conard, Thierry; Nohira, Hiroshi; Pétry, Jasmine; Richard, Olivier; Zhao, Chao; Brijs, Bert; Besling, Wim; Detavernier, C.; Vandervorst, Wilfried; Caymax, Matty; De Gendt, Stefan; Chen, Jian; Kluth, Jon; Tsai, Wilman; Maes, Jos (2001) -
Raman spectroscopy as a stress sensor in packaging: correct formulae for different sample surfaces
Chen, Jian; De Wolf, Ingrid (2002) -
Stress evaluation in packaging using Raman spectroscopy and finite element simulation
Chen, Jian (2004-04) -
Study of damage and stress induced by backgrinding in Si wafers
Chen, Jian; De Wolf, Ingrid (2003) -
Temperature profile measurement and failure characterization of ESD protection devices using spectroscopic photon emission microscopy and Raman spectroscopy
Rasras, Mahmoud; De Wolf, Ingrid; Groeseneken, Guido; Chen, Jian; Bock, Karlheinz; Maes, Herman (1999) -
Theoretical and experimental Raman spectroscopy study of mechanical stress induced by electronic packaging
Chen, Jian; De Wolf, Ingrid (2005) -
Thermal processing of high-K materials thermodynamics and kinetics
Young, Edward; Chen, Jian; Cosnier, Vincent; Lysaght, P.; Maes, Jan; Roozeboom, F.; Zhao, Chao (2002)