Browsing by author "Kurz, Florian"
Now showing items 1-3 of 3
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3D-SoC integration utilizing high accuracy wafer level bonding
Peng, Lan; Kim, Soon-Wook; Heylen, Nancy; Reichardt, Maik; Kurz, Florian; Wagenleitner, Thomas; Sleeckx, Erik; Struyf, Herbert; Rebibis, Kenneth June; Miller, Andy; Beyer, Gerald; Beyne, Eric (2016) -
Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2016) -
Influence of wafer-to-wafer bond alignment on via-last patterning for 3DSOC applications
De Vos, Joeri; Peng, Lan; Van Ongeval, Joost; Phommahaxay, Alain; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas (2017)