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Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
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Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects
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Date
2016
Proceedings Paper
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
De Vos, Joeri
;
Peng, Lan
;
Phommahaxay, Alain
;
Van Ongeval, Joost
;
Miller, Andy
;
Beyne, Eric
;
Kurz, Florian
;
Wagenleiter, Thomas
;
Wimplinger, Markus
;
Uhrmann, Thomas
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Views
1850
since deposited on 2021-10-23
1
last month
1
last week
Acq. date: 2026-01-06
Citations