Authors

De Vos, Joeri; Peng, Lan; Phommahaxay, Alain; Van Ongeval, Joost; Miller, Andy; Beyne, Eric; Kurz, Florian; Wagenleiter, Thomas; Wimplinger, Markus; Uhrmann, Thomas

Conference

IEEE International Conference on 3D System Integration - 3DIC

Title

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

Publication type

Proceedings paper