Publication:

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

Date

2016
Proceedings Paper
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dc.contributor.authorDe Vos, Joeri
dc.contributor.authorPeng, Lan
dc.contributor.authorPhommahaxay, Alain
dc.contributor.authorVan Ongeval, Joost
dc.contributor.authorMiller, Andy
dc.contributor.authorBeyne, Eric
dc.contributor.authorKurz, Florian
dc.contributor.authorWagenleiter, Thomas
dc.contributor.authorWimplinger, Markus
dc.contributor.authorUhrmann, Thomas
dc.contributor.imecauthorDe Vos, Joeri
dc.contributor.imecauthorPeng, Lan
dc.contributor.imecauthorPhommahaxay, Alain
dc.contributor.imecauthorVan Ongeval, Joost
dc.contributor.imecauthorMiller, Andy
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDe Vos, Joeri::0000-0002-9332-9336
dc.contributor.orcidimecPeng, Lan::0000-0003-1824-126X
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-23T10:29:30Z
dc.date.available2021-10-23T10:29:30Z
dc.date.issued2016
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/26519
dc.identifier.urlhttp://ieeexplore.ieee.org/document/7970002/
dc.source.beginpage1
dc.source.conferenceIEEE International Conference on 3D System Integration - 3DIC
dc.source.conferencedate8/11/2016
dc.source.conferencelocationSan Francisco, CA USA
dc.source.endpage4
dc.title

Importance of alignment control during permanent bonding and its impact on via- last alignment for high density 3D interconnects

dc.typeProceedings paper
dspace.entity.typePublication
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