Browsing by author "Posada Quijano, Guillermo"
Now showing items 1-17 of 17
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3D chip stacking of RF devices with Cu TSV, Cu/Sn bumps and sealing ring
Zhang, Wenqi; Majeed, Bivragh; Sun, Xiao; Posada Quijano, Guillermo; Diekmann, C.; Eggs, C.; Schmidhammer, E.; De Raedt, Walter (2011) -
3D stack packaging solution for FBAR devices_3D packaging demonstrator and RF performance
Sun, Xiao; Posada Quijano, Guillermo; Majeed, Bivragh; Zhang, Wenqi; De Raedt, Walter; Diekmann, C.; Eggs, C.; Schmidhammer, E. (2011) -
3D stacking of microwave modules for high-density packaging
Posada Quijano, Guillermo (2008-08) -
Compact (<0.5mm2) K-band metamaterial bandpass filter in MCM-D technology
Bonache, Jordi; Posada Quijano, Guillermo; Carchon, Geert; De Raedt, Walter; Martin, Ferran (2007) -
High-performance SiP modules
Carchon, Geert; Posada Quijano, Guillermo (2008) -
Horizontal integration of cavity filters on high-resistivity silicon thin-film technology
Posada Quijano, Guillermo; Carchon, Geert; Nauwelaers, Bart; De Raedt, Walter (2008) -
Microstrip thin-film MCM-D technology as enabling platform for the integration of high-performance SiP modules
Posada Quijano, Guillermo; Carchon, Geert; Soussan, Philippe; Pham, Nga; Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter; Nauwelaers, Bart; De Raedt, Walter; Beyne, Eric (2007-11) -
Microstrip thin-film MCM-D technology on high-resistivity silicon with integrated through-substrate vias
Posada Quijano, Guillermo; Carchon, Geert; Soussan, Philippe; Pham, Nga; Majeed, Bivragh; Sabuncuoglu Tezcan, Deniz; Ruythooren, Wouter; Nauwelaers, Bart; De Raedt, Walter (2007) -
System-in-a-package technology for 3D integration of radar modules
Brebels, Steven; Sun, Xiao; Posada Quijano, Guillermo; Dussopt, Laurent; Dubois, Marc-Alexandre; Vandenbosch, Guy; De Raedt, Walter (2008) -
Technology platform integrates high-performance SiP modules
Carchon, Geert; Posada Quijano, Guillermo (2008) -
Technology platform integrates high-performance SiP modules
Carchon, Geert; Posada Quijano, Guillermo (2008) -
Thin-film as enabling passive integration technology for RF SoC and SiP
Carchon, Geert; Sun, Xiao; Posada Quijano, Guillermo; Linten, Dimitri; Beyne, Eric (2005-02) -
Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
Posada Quijano, Guillermo; Carchon, Geert; Nauwelaers, Bart; De Raedt, Walter (2008) -
Thin-film multi-chip module technology in high-resistivity Si for the integration of millimeter wave systems
Posada Quijano, Guillermo; Carchon, Geert; Poesen, Gert; Nauwelaers, Bart; De Raedt, Walter (2005) -
Thin-film technologies for mm-wave passives and antenna-interface realization
Carchon, Geert; Posada Quijano, Guillermo; Brebels, Steven; Vasylchenko, Alexander; De Raedt, Walter (2008) -
Towards 3D integration of system in a package modules
Carchon, Geert; Posada Quijano, Guillermo (2008) -
Ultra-miniaturized integrated cavities on high-resistivity silicon thin-film MCM-D technology
Posada Quijano, Guillermo; Carchon, Geert; Nauwelaers, Bart; De Raedt, Walter (2008)