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Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
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Authors
Posada Quijano, Guillermo
;
Carchon, Geert
;
Nauwelaers, Bart
;
De Raedt, Walter
Conference
58th Electronic Components and Technology Conference - ECTC
Title
Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
Publication type
Proceedings paper
Embargo date
9999-12-31
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