Publication:
Thin-film MCM-D technology with through-substrate vias for the integration of 3D SiP modules
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1883 since deposited on 2021-10-17
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Acq. date: 2026-07-31
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Statistics
Views
1883 since deposited on 2021-10-17
2last month
2last week
Acq. date: 2026-07-31
Citations