Browsing by author "Baier, Ulrich"
Now showing items 1-4 of 4
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Dry etch challenges for implantable silicon-based semi-flexible neural probe fabrication
Tutunjyan, Nina; Andrei, Alexandru; Verbinnen, Greet; Slabbekoorn, John; Eberle, Wolfgang; Baier, Ulrich; Boullart, Werner (2011) -
Exploring high aspEct ratio 2μm TSV (25:1)
Kostermans, Maarten; Brouri, Mohand; Baier, Ulrich; Vertommen, Johan; Pageau, Arnaud; Boullart, Werner (2011-11) -
Implementation of an industry compliant, 5×50μm, via-middle TSV technology on 300mm wafers
Redolfi, Augusto; Velenis, Dimitrios; Thangaraju, Sarasvathi; Nolmans, Philip; Jaenen, Patrick; Kostermans, Maarten; Baier, Ulrich; Van Besien, Els; Dekkers, Harold; Witters, Thomas; Jourdan, Nicolas; Van Ammel, Annemie; Vandersmissen, Kevin; Rodet, Simon; Philipsen, Harold; Radisic, Alex; Heylen, Nancy; Travaly, Youssef; Swinnen, Bart; Beyne, Eric (2011-06) -
Patterning challenges of optical waveguides for sensing applications
Jamieson, Geraldine; Baier, Ulrich; Duval, Fabrice; Verheyen, Peter; Absil, Philippe; Lepage, Guy (2012)