Browsing by author "Kaneko, S"

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A high-reliable Cu/ULK integration scheme using Metal Hard Mask and Low-k capping film

Travaly, Youssef; Tsutsue, M.; Ikeda, Atsushi; Verdonck, Patrick; Tokei, Zsolt; Willegems, Myriam; Van Aelst, Joke; Struyf, Herbert; Vereecke, Guy; Kesters, Els; Le, Quoc Toan; Claes, Martine; Heylen, Nancy; Sinapi, Fabrice; Richard, Olivier; De Roest, David; Kaneko, S; Kemeling, N; Fukazawa, A; Matsuki, N; Matsushita, K; Tsuji, N; Kagami, K; Sprey, Hessel; Beyer, Gerald (2007)
Variation in process conditions of porogen-based low-k films: A method to improve performance without changing existing process steps in a sub-100 nm Cu damascene integration route

De Roest, David; Travaly, Youssef; Beynet, J.; Sprey, Hessel; Labat, J.; Huffman, Craig; Verdonck, Patrick; Kaneko, S; Matsushita, K; Kobayashi, N; Beyer, Gerald (2010)