Browsing by author "Tobback, Bert"

DEMONSTRATING ELECTRICAL CONNECTION ON RECONSTITUTED ASIC CHIPS ON 8-INCH SILICON WAFER

Wei, Wei; Zhang, Lei; Tobback, Bert; Visker, Jakob; Stakenborg, Tim; Karve, Gauri; Sabuncuoglu Tezcan, Deniz (2024)

Fabrication challenges in integrating self-assembled block copolymer process in semiconductor devices

Seema Saseendran, Sandeep; Paneri, Abhilash; Tobback, Bert; Kutrzeba Kotowska, Bogumila; Vecchio, Emma; Jamieson, Geraldine; Paraschiv, Vasile; Figeys, Bruno; Suh, Hyo Seon; Sabuncuoglu Tezcan, Deniz; Takahashi, Kohei; Fujikane, Masaki; Himeno, Atsushi; Nakamura, Kunihiko; Tambo, Naoki; Nakata, Yuki; Tanaka, Hiroyuki; Naito, Yasuyuki (2020)

Low temperature backside damascene processing on temporary carrier wafer targeting 7 mu m and 5 mu m pitch microbumps for N equal and greater than 2 die to wafer TCB stacking

Derakhshandeh, Jaber; Beyne, Eric; Beyer, Gerald; Capuz, Giovanni; Cherman, Vladimir; De Preter, Inge; Gerets, Carine; Shafahian, Ehsan; Kennes, Koen; Jamieson, Geraldine; Cochet, Tom; Webers, Tomas; Tobback, Bert; Van der Plas, Geert; La Tulipe, Douglas Charles; Phommahaxay, Alain; Miller, Andy (2022)

Optimization of through Si via last microlithography for 3D packaging

Slabbekoorn, John; Tobback, Bert; Vandeweyer, Tom; Miller, Andy; Flack, Warren; Hsieh, Robert; Kenyon, Gareth (2015)

Overlay performance of through Si via last lithography for 3d packaging

Flack, Warren; Hsieh, Robert; Kenyon, Gareth; Slabbekoorn, John; Czarnecki, Piotr; Tobback, Bert; Van Huylenbroeck, Stefaan; Stucchi, Michele; Vandeweyer, Tom; Miller, Andy (2016)