Browsing by author "Wei, Tiwei"
Now showing items 1-18 of 18
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3D printed liquid jet impingement cooler: Demonstration, opportunities and challenges
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Baelmans, Martine (2018) -
A cold shower for chips
Oprins, Herman; Wei, Tiwei; Cherman, Vladimir; Beyne, Eric (2018-12) -
A cool design for hot microchips
Wei, Tiwei (2020) -
Conjugate heat transfer and fluid flow model for microjet cooling with alternating feeding and draining channels
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric; Baelmans, Martine (2019) -
Demonstration of Package Level 3D-printed Direct Jet Impingement Cooling applied to High power, Large Die Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Z.; Rivera, K.; Van der Plas, Geert; Pawlak, Bartek; England, L.; Beyne, Eric; Baelmans, M. (2020) -
Experimental and numerical investigation of the direct jet impinging cooling on lidded or lidless package for 2.5D integrated systems using 3D printing technology
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric; Baelmans, Martine (2020) -
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Yang, Zhi; Rivera, Kathryn C.; Van der Plas, Geert; England, Luke; Baelmans, Martine; Pawlak, Bartek; Beyne, Eric (2021) -
Experimental characterization and model validation of liquid jet impingement cooling using a high spatial resolution and programmable thermal test chip
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Baelmans, Tine (2019) -
Experimental characterization of a chip level 3D printed microjet liquid impingement cooler for high performance systems
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Yang, Shoufeng; Martine, Baelmans (2019) -
First demonstration of a low cost/customizable chip level 3D printed microjet hotspot-targeted cooler for high power applications
Wei, Tiwei; Oprins, Herman; Beyne, Eric; Cherman, Vladimir; De Wolf, Ingrid; Baelmans, Martine (2019-05) -
Heat transfer and pressure drop correlations for direct on-chip microscale jet impingement cooling with alternating feeding and draining jets
Fang, Liang; Baelmans, Martine; Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric (2022-01) -
High efficiency direct liquid jet impingement cooling of high power devices using a 3D-shaped polymer cooler
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Baelmans, Martine (2017) -
High efficiency polymer based direct multi-jets impingement cooling for high power devices
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Qian, Jun; De Wolf, Ingrid; Beyne, Eric; Baelmans, Martine (2019) -
Low-cost energy efficient on-chip hotspot targeted microjet cooling for high power electronics
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; Beyne, Eric; Baelmans, Martine (2020) -
Nozzle array scaling analysis of the thermal performance of liquid jet impingement coolers for high performance electronic applications
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Baelmans, Martine (2018) -
Nozzle Scaling Effects for The Thermohydraulic Performance of Microjet Impingement Cooling with Distributed Returns
Wei, Tiwei; Oprins, Herman; Fang, Liang; Cherman, Vladimir; De Wolf, Ingrid; Beyne, Eric; Baelmans, Tine (2020) -
Preliminary Study on Hybrid Manufacturing of the Electrical-Mechanical Integrated Systems (EMIS) Assisted by the LCD Stereolithography Technology
Fei, Guanghai; Wei, Tiwei; Qimin, Shi; Guo, Yongjian; Oprins, Herman; Yang, Shoufeng (2019) -
Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages
Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Van der Plas, Geert; Beyne, Eric; Baelmans, Martine (2019)