Authors

Wei, Tiwei; Oprins, Herman; Cherman, Vladimir; De Wolf, Ingrid; Van der Plas, Geert; Beyne, Eric; Baelmans, Martine

Conference

2019 18th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

Title

Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages

Publication type

Proceedings paper

Embargo date

9999-12-31