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Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages
Publication:
Thermal analysis of polymer 3D printed jet impingement coolers for high performance 2.5D Si interposer packages
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Date
2019
Proceedings Paper
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39582.pdf
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Wei, Tiwei
;
Oprins, Herman
;
Cherman, Vladimir
;
De Wolf, Ingrid
;
Van der Plas, Geert
;
Beyne, Eric
;
Baelmans, Martine
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1894
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Acq. date: 2025-12-15
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Metrics
Views
1894
since deposited on 2021-10-27
2
last month
Acq. date: 2025-12-15
Citations