Browsing by author "Vermeiren, Filip"
Now showing items 1-6 of 6
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A reliable and comfortable package for wearable medical devices
Sterken, Tom; Vanfleteren, Jan; Bossuyt, Frederick; Brebels, Steven; Christiaens, Wim; Vervust, Thomas; Jablonski, Michal; Dunphy, Sheila; Vermeiren, Filip; Hsu, Y.-Y.; Torfs, Tom; Op de Beeck, Maaike (2011) -
Adhesion test for UTCP structure in humid environment
Kokko, Kati; Sterken, Tom; Vermeiren, Filip; Vanfleteren, Jan (2013) -
Embedded UTCP interposers for miniature smart sensors
Sterken, Tom; Op de Beeck, Maaike; Torfs, Tom; Vermeiren, Filip; Van Hoof, Chris; Vanfleteren, Jan (2012) -
Embedding thinned dies in flexible PCBs
Sterken, Tom; Vermeiren, Filip; Tremlett, P.; Christiaens, Wim; Vanfleteren, Jan (2012) -
High yield embedding of 30μm thin chips in a flexible PCB using a photopatternable polyimide based ultra-thin chip package (UTCP)
Sterken, Tom; Op de Beeck, Maaike; Vermeiren, Filip; Torfs, Tom; Wang, Liang; Priyabadini, Swarnakamal; Dhaenens, Kristof; Cuypers, Dieter; Vanfleteren, Jan (2012) -
Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
Jarboui, Ahmed; Cauwe, Maarten; Vermeiren, Filip; Verplancke, Rik; Hamadi, Khemakhem; Vanfleteren, Jan; Op de Beeck, Maaike (2013)