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Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
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Authors
Jarboui, Ahmed
;
Cauwe, Maarten
;
Vermeiren, Filip
;
Verplancke, Rik
;
Hamadi, Khemakhem
;
Vanfleteren, Jan
;
Op de Beeck, Maaike
Conference
The 4th Flex & Stretch Conference
Title
Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
Publication type
Oral presentation
Embargo date
9999-12-31
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