Publication:
Parylene-C for hermetic and flexible encapsulation of interconnects and electronic components
Date
Loading...
Files
Journal
Abstract
Description
Metrics
Downloads
1 since deposited on 2021-10-21
Acq. date: 2025-10-26
Views
1971 since deposited on 2021-10-21
Acq. date: 2025-10-26
Citations
Metrics
Downloads
1 since deposited on 2021-10-21
Acq. date: 2025-10-26
Views
1971 since deposited on 2021-10-21
Acq. date: 2025-10-26
Citations