Now showing items 1-7 of 7

    • BEOL N2: M2 through SAxP process from MP21 to MP26: 193i SAQP vs EUV SADP 

      Hermans, Yannick; Wu, Chen; Buccheri, Nunzio; Schleicher, Filip; Versluijs, Janko; Montero Alvarez, Daniel; Dey, Bappaditya; Wong, Patrick; Rincon Delgadillo, Paulina; Park, Seongho; Tokei, Zsolt; Leray, Philippe; Halder, Sandip (2023-04-28)
    • Enabling 3-level High Aspect Ratio Supervias for 3nm nodes and below 

      Montero Alvarez, Daniel; Vega Gonzalez, Victor; Feurprier, Yannick; Varela Pedreira, Olalla; Oikawa, Noriaki; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Versluijs, Janko; De Coster, Hanne; Bazzazian, Nina; Jourdan, Nicolas; Kumar, Kaushik; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2022-06-29)
    • Exploring the use of Tungsten-based Hard Masks in BEOL interconnects for 3nm node and beyond 

      Montero Alvarez, Daniel; Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Nie, Jiuyuan; Yang, Jialing; Schleicher, Filip; Mclaughlin, Kevin; Versluijs, Janko; Lazzarino, Frederic; Park, Seongho; Tokei, Zsolt (2022-11-10)
    • High Aspect Ratio Supervia Dual Damascene etch for iN5 and beyond 

      Puliyalil, Harinarayanan; Feurprier, Yannick; Oikawa, Noriaki; Vega Gonzalez, Victor; Briggs, Basoene; Montero Alvarez, Daniel; Lazzarino, Frederic; Tokei, Zsolt; Satoru, Nakamura; Tahara, Shigeru; Kumar, Kaushik (2021)
    • Improving uniformity of 3-level High Aspect Ratio Supervias 

      Montero Alvarez, Daniel; Marien, Philippe; Hermans, Yannick; Vega Gonzalez, Victor; Feurprier, Y.; Oikawa, N.; Buccheri, Nunzio; Wu, Chen; Martinez Alanis, Gerardo Tadeo; Batuk, Dmitry; Puliyalil, Harinarayanan; Decoster, Stefan; Kumar, K.; Lazzarino, Frederic; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt (2023)
    • Process Integration of High Aspect Ratio Vias with a Comparison between Co and Ru Metallizations 

      Vega Gonzalez, Victor; Montero Alvarez, Daniel; Versluijs, Janko; Varela Pedreira, Olalla; Jourdan, Nicolas; Puliyalil, Harinarayanan; Chehab, Bilal; Peissker, Tobias; Haider, Ali; Batuk, Dmitry; Martinez Alanis, Gerardo Tadeo; Geypen, Jef; Le, Quoc Toan; Bazzazian, Nina; Heylen, Nancy; van der Veen, Marleen; El-Mekki, Zaid; Webers, Tomas; Vats, H.; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Gillijns, Werner; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Ciofi, Ivan; De Wachter, Bart; Swerts, Johan; Grieten, Eva; Ercken, Monique; Kim, Ryan Ryoung han; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Nagesh, Nishanth; Ramakers, Leon; Murdoch, Gayle; Park, Seongho; Tokei, Zsolt; Dentoni Litta, Eugenio; Horiguchi, Naoto (2021)
    • Supervia Process Integration and Reliability Compared to Stacked Vias Using Barrierless Ruthenium 

      Vega Gonzalez, Victor; Puliyalil, Harinarayanan; Versluijs, Janko; Lesniewska, Alicja; Varela Pedreira, Olalla; Baert, Rogier; Paolillo, Sara; Decoster, Stefan; Schleicher, Filip; Montero Alvarez, Daniel; Bekaert, Joost; Kesters, Els; Le, Quoc Toan; Lorant, Christophe; Teugels, Lieve; Heylen, Nancy; Jourdan, Nicolas; El-Mekki, Zaid; van der Veen, Marleen; Ciofi, Ivan; Briggs, Basoene; Heijlen, Jeroen; Dupas, Luc; De Wachter, Bart; Vancoille, Eric; Webers, Tomas; Vats, Hemant; Rynders, Luc; Cupak, Miroslav; Lee, Jae Uk; Drissi, Youssef; Halipre, Luc; Charley, Anne-Laure; Verdonck, Patrick; Witters, Thomas; Van Gompel, Sander; Kimura, Yosuke; Demonie, Ingrid; Lazzarino, Frederic; Ercken, Monique; Kim, Ryan Ryoung han; Trivkovic, Darko; Croes, Kristof; Leray, Philippe; Jaysankar, Manoj; Wilson, Chris; Murdoch, Gayle; Tokei, Zsolt (2020)