Browsing by imec author "5d18d0b8555376d05523aa0bd338318b7c6556c2"
Now showing items 21-27 of 27
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Post patterning meso porosity creation: a potential solution for pore sealing
Caluwaerts, Rudy; Van Hove, Marleen; Beyer, Gerald; Hoofman, Romano; Struyf, Herbert; Brom - Verheyden, Greja; Waeterloos, Joost; Tokei, Zsolt; Iacopi, Francesca; Carbonell, Laure; Le, Quoc Toan; Das, Arabinda; Vos, Ingrid; Demuynck, Steven; Maex, Karen (2003) -
Preparation and characterization of electrochemically deposited copper alloys
Le, Quoc Toan; Vervoort, Iwan; Caluwaerts, Rudy; Conard, Thierry; Vanhaeren, Danielle; Maex, Karen (2002) -
Scaling down thickness of ULK materials for 65 node and below and its efect on electrical performance
Fruhauf, S.; Himcinschi, C.; Rennau, M.; Schulze, K.; Schulz, S.E.; Friedrich, M.; Gessner, T.; Zahn, D.R.T.; Le, Quoc Toan; Caluwaerts, Rudy (2005) -
The critical role of the metal / porous low-k interface in post direct CMP defectivity generation and resulting ULK surface and bulk hydrophilisation
Travaly, Youssef; Sinapi, Fabrice; Heylen, Nancy; Humbert, Aurelie; Delande, Tinne; Caluwaerts, Rudy; Gueneau de Mussy, Jean Paul; Vereecke, Guy; Baklanov, Mikhaïl; Iacopi, Francesca; Hernandez, Jose Luis; Beyer, Gerald; Fischer, Pamela (2007) -
Ultra-low copper baths for sub-30nm copper interconnects
Atanasova, Tanya; Caluwaerts, Rudy; Carbonell, Laure; Strubbe, Katrien; Vereecken, Philippe (2011) -
Ultra-low copper baths for sub-35 nm copper interconnects
Atanasova, Tanya; Carbonell, Laure; Caluwaerts, Rudy; Tokei, Zsolt; Strubbe, Katrien; Vereecken, Philippe (2013) -
Ultra-low copper baths for sub-35nm copper interconnects
Atanasova, Tanya; Carbonell, Laure; Caluwaerts, Rudy; Tokei, Zsolt; Strubbe, Katrien; Vereecken, Philippe (2012)