Browsing by author "Sun, Xiao"
Now showing items 21-40 of 67
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Cost-effective RF interposer platform on low-resistivity Si enabling heterogeneous integration opportunities for beyond 5G
Sun, Xiao; Slabbekoorn, John; Sinha, Siddhartha; Bex, Pieter; Pinho, Nelson; Webers, Tomas; Velenis, Dimitrios; Miller, Andy; Collaert, Nadine; Van der Plas, Geert; Beyne, Eric (2022) -
Demonstration of heterogeneous integration of technologies for a Ku-band SiP Doppler radar
Sun, Xiao; Brebels, Steven; Stoukatch, Serguei; Jansen, Roelof; Dussopt, L.; Dubois, M.A.; O'Mahony, C.; Berberich, S.; Houlihan, R.; De Raedt, Walter (2008) -
Efficient Backside Power Delivery for High-Performance Computing Systems
Lin, Hesheng; van der Plas, Geert; Sun, Xiao; Velenis, Dimitrios; Catthoor, Francky; Lauwereins, Rudy; Beyne, Eric (2022) -
Efficient Characterization of Interconnects With Arbitrary Polygonal Cross Sections Using Fokas-Derived Dirichlet-to-Neumann Operators
Bosman, Dries; Huynen, Martijn; De Zutter, Daniel; Sun, Xiao; Pantano, Nicolas; van der Plas, Geert; Beyne, Eric; Ginste, Dries Vande; Vande Ginste, Dries (2023) -
Electron band alignment at the interface of (100)GaSb with molecular-beam deposited Al2O3
Afanasiev, Valeri; Chou, H.-Y.; Stesmans, Andre; Merckling, Clement; Sun, Xiao (2011) -
Entire domain basis function expansion of the differential surface admittance for efficient broadband characterization of lossy interconnects
Huynen, Martijn; Kapusuz, Kamil Yavuz; Sun, Xiao; Van der Plas, Geert; Beyne, Eric; De Zutter, Daniel; Vande Ginste, Dries (2020) -
Evaluation of photosensitive spin-on-dielectrics for 3-D wafer level packaging
Duval, Fabrice; Soussan, Philippe; Miller, Andy; De Raedt, Walter; Sun, Xiao; Beyne, Eric; Okoro, Chukwudi (2010) -
Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements
Rack, Martin; Raskin, J.P.; Sun, Xiao; Van der Plas, Geert; Absil, Philippe; Beyne, Eric (2016) -
Fat damascene wires for high bandwidth routing in silicon interposer
Detalle, Mikael; Kim, Jaemin; Nolmans, Philip; Sun, Xiao; Ryckaert, Julien; La Manna, Antonio; Beyer, Gerald; Beyne, Eric (2012) -
GaSb molecular beam epitaxial growth on p-InP(001) and passivation with in situ deposited Al2O3 gate oxide
Merckling, Clement; Sun, Xiao; Alian, AliReza; Brammertz, Guy; Afanasiev, Valeri; Hoffmann, Thomas Y.; Heyns, Marc; Caymax, Matty; Dekoster, Johan (2011) -
High-Q above-IC inductors and transmission lines - comparison to Cu back-end performance
Carchon, Geert; Sun, Xiao; De Raedt, Walter (2004-06) -
High-Q inductors and transmission lines on 20O.cm Si using wafer-level packaging technology
Carchon, Geert; Sun, Xiao; De Raedt, Walter (2003) -
High-Q on-chip inductors using thin-film wafer level packaging technology demonstrated on a 90nm RF-CMOS 5GHz VCO
Sun, Xiao; Linten, Dimitri; Dupuis, Olivier; Carchon, Geert; Soussan, Philippe; Decoutere, Stefaan; De Raedt, Walter (2005-10) -
High-Q RF inductors on low resistivity silicon realized using wafer-level packaging techniques
Carchon, Geert; Sun, Xiao; De Raedt, Walter (2003) -
High-speed TSV integration in an active silicon photonics interposer platform
Bogaerts, Lieve; El-Mekki, Zaid; Van Huylenbroeck, Stefaan; Nolmans, Philip; Pantano, Nicolas; Sun, Xiao; Rakowski, Michal; Velenis, Dimitrios; Verheyen, Peter; Balakrishnan, Sadhishkumar; De Heyn, Peter; Ban, Yoojin; Srinivasan, Ashwyn; Lardenois, Sebastien; De Coster, Jeroen; Detalle, Mikael; Absil, Philippe; Miller, Andy; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
Hybrid 14nm FinFET - Silicon photonics technology for low-power Tb/s/mm2 optical I/O
Rakowski, Michal; Ban, Yoojin; De Heyn, Peter; Pantano, Nicolas; Snyder, Brad; Balakrishnan, Sadhishkumar; Van Huylenbroeck, Stefaan; Bogaerts, Lieve; Demeurisse, Caroline; Inoue, Fumihiro; Rebibis, Kenneth June; Nolmans, Philip; Sun, Xiao; Bex, Pieter; Srinivasan, Ashwyn; De Coster, Jeroen; Lardenois, Sebastien; Miller, Andy; Absil, Philippe; Verheyen, Peter; Velenis, Dimitrios; Pantouvaki, Marianna; Van Campenhout, Joris (2018) -
III-V/III-N technologies for next generation high-capacity wireless communication
Collaert, Nadine; Alian, AliReza; Banerjee, Aritra; Boccardi, Guillaume; Cardinael, Pieter; Chauhan, Vikas; Desset, Claude; ElKashlan, Rana Y.; Khaled, Ahmad; Ingels, Mark; Kunert, Bernardette; Mols, Yves; O'Sullivan, Barry; Peralagu, Uthayasankaran; Pinho, Nelson; Rodriguez, Raul; Sibaja-Hernandez, Arturo; Sinha, Siddhartha; Sun, Xiao; Vais, Abhitosh; Vermeersch, Bjorn; Yadav, Sachin; Yan, Dongyang; Yu, Hao; Zhang, Yang; Zhao, Ming; Van Driessche, Veerle; Gramegna, Giuseppe; Wambacq, Piet; Parvais, Bertrand; Peeters, Michael (2022) -
Improved AC conductance and Gray-Brown methods to characterize fast and slow traps in Ge metal–oxide–semiconductor capacitors
Sun, Xiao; Merckling, Clement; Brammertz, Guy; Lin, Dennis; Dekoster, Johan; Cui, Sharin; Ma, T. P. (2012) -
Improved staggered through silicon via inductors for RF and power applications
Sun, Xiao; Van der Plas, Geert; Beyne, Eric (2018) -
Inductive links for 3D stacked chip-to-chip communication
Sun, Xiao; Pantano, Nicolas; Kim, Soon-Wook; Van der Plas, Geert; Beyne, Eric (2019)