Authors

Rack, Martin; Raskin, J.P.; Sun, Xiao; Van der Plas, Geert; Absil, Philippe; Beyne, Eric

Conference

IEEE 66th Electronic Components and Technology Conference - ECTC

Title

Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements

Publication type

Proceedings paper

Embargo date

9999-12-31