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Fast and accurate modeling of large TSV arrays in 3D-ICs using a 3D circuit model validated against full-wave FEM simulations and RF measurements
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2018 since deposited on 2021-10-23
Acq. date: 2026-05-18
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Statistics
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2018 since deposited on 2021-10-23
Acq. date: 2026-05-18
Citations