Browsing by author "Marchal, Pol"
Now showing items 21-40 of 85
-
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2011-05) -
Co-optimizing system design and 3D technology
Marchal, Pol (2010-03) -
Comprehensive analysis of the impact of single and arrays of through silicon vias induced stress on high-k / metal gate CMOS performances
Mercha, Abdelkarim; Van der Plas, Geert; Moroz, V.; De Wolf, Ingrid; Asimakopoulos, Panagiotis; Minas, Nikolaos; Domae, Shinichi; Perry, Dan; Choi, M.; Redolfi, Augusto; Okoro, Chukwudi; Yang, Yu; Van Olmen, Jan; Thangaraju, Sarasvathi; Sabuncuoglu Tezcan, Deniz; Soussan, Philippe; Cho, Jong Hoon; Yakovlev, A.; Marchal, Pol; Travaly, Youssef; Beyne, Eric; Biesemans, Serge; Swinnen, Bart (2010) -
Convergenze tecnologiche
Provoost, Jan; Marchal, Pol (2011-11) -
Cost-efficient mapping of dynamic concurrent tasks in embedded real-time multimedia systems
Yang, Peng; Marchal, Pol; Wong, Chun; Himpe, Stefaan; Catthoor, Francky; David, Patrick; Vounckx, Johan; Lauwereins, Rudy (2004) -
Data-access optimization of embedded systems through selective inlining transformation
Absar, Javed; Marchal, Pol; Catthoor, Francky (2005-09) -
Design issues and cosiderations for low-cost 3D TSV IC technology
Van der Plas, Geert; Limaye, Paresh; Mercha, Abdelkarim; Oprins, Herman; Torregiani, Cristina; Thijs, Steven; Linten, Dimitri; Stucchi, Michele; Guruprasad, Katti; Velenis, Dimitrios; Shinichi, Domae; Cherman, Vladimir; Vandevelde, Bart; Simons, Veerle; De Wolf, Ingrid; Labie, Riet; Perry, Dan; Bronckers, Stephane; Minas, Nikolaos; Cupak, Miroslav; Ruythooren, Wouter; Van Olmen, Jan; Phommahaxay, Alain; de Potter de ten Broeck, Muriel; Opdebeeck, Ann; Rakowski, Michal; De Wachter, Bart; Dehan, Morin; Nelis, Marc; Agarwal, Rahul; Dehaene, Wim; Travaly, Youssef; Marchal, Pol; Beyne, Eric (2010) -
Design issues in heterogeneous 3D/2.5D integration
Milojevic, Dragomir; Marchal, Pol; Marinissen, Erik Jan; Van der Plas, Geert; Verkest, Diederik; Beyne, Eric (2013-01) -
Design of test structures for the characterization of thermal-mechanical stress in 3D stacked IC
Minas, Nikolaos; Van der Plas, Geert; Oprins, Herman; Mercha, Abdelkarim; Cherman, Vladimir; Torregiani, Cristina; Rakowski, Michal; Marchal, Pol (2012) -
Design, verification and simulation of 3D circuit
Katti, Guruprasad; De Wachter, Bart; Nelis, Marc; Dehan, Morin; Cupak, Miroslav; Croes, Kris; Beeckman, Gerd; Marchal, Pol; Stucchi, Michele (2009) -
Dynamic memory oriented transformations in the MPEG4 IM1-player on a low power platform
Marchal, Pol; Wong, Chun; Prayati, Aggeliki; Cossement, Nathalie; Catthoor, Francky; Lauwereins, Rudy; Verkest, Diederik; De Man, Hugo (2000) -
Dynamic memory oriented transformations in the MPEG4 IM1-player on a low power platform
Marchal, Pol; Wong, Chun; Prayati, Aggeliki; Cossement, Nathalie; Catthoor, Francky; Lauwereins, Rudy; Verkest, Diederik; De Man, Hugo (2001) -
Dynamisches Mapping konkurrierender Anwendungen auf Multiprozessor-Systemen
Van Bavel, Mieke; Yang, Peng; Wong, Chun; Marchal, Pol (2003-10) -
Energy-aware runtime scheduling for embedded-multiprocessor SOCs
Yang, Peng; Wong, Chun; Marchal, Pol; Catthoor, Francky; Desmet, Dirk; Verkest, Diederik; Lauwereins, Rudy (2001) -
Energy-efficient multiprocessor systems-on-chip for embedded computing: exploring programming models and their architectural support
Poletti, F.; Poggiali, A.; Bertozzi, D.; Benini, L.; Marchal, Pol; Loghi, M.; Poncino, M. (2007-05) -
Evaluating the risks and benefits of 3-D technology
Marchal, Pol; Van Bavel, Mieke (2009-08) -
Evaluation of energy-recovering interconnects for low-power 3D stacked ICs
Asimakopoulos, Panagiotis; Van der Plas, Geert; Yakovlev, A.; Marchal, Pol (2009) -
Experimental characterization and model validation of thermal hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Srinivasan, Adi; Cupak, Miroslav; Van der Plas, Geert; Marchal, Pol; Vandevelde, Bart; Cheng, Edmund (2010-10) -
Exploration of low power adders for a SIMD data path
Paci, Giacomo; Marchal, Pol; Benini, L. (2007) -
Fast and power efficient dynamic data-layout with DMA-capable memories
Absar, Javed; Polletti, Francesco; Marchal, Pol; Catthoor, Francky; Benini, Luca (2004)