Browsing by author "Vandevelde, Bart"
Now showing items 41-60 of 280
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Chip package interaction
Vandevelde, Bart (2013) -
Chip package interaction (CPI): thermo mechanical challenges in 3D technologies
Gonzalez, Mario; Vandevelde, Bart; Ivankovic, Andrej; Cherman, Vladimir; Debecker, Bjorn; Lofrano, Melina; De Wolf, Ingrid; Beyer, Gerald; Swinnen, Bart; Tokei, Zsolt; Beyne, Eric (2012) -
Chip-package interaction
De Wolf, Ingrid; Vandevelde, Bart; Debecker, Bjorn; Ivankovic, Andrej; Vanstreels, Kris; Gonzalez, Mario; Lofrano, Melina; Guo, Wei; Cherman, Vladimir (2013) -
Chip-package interaction in 3D stacked IC packages using finite element modelling
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Guo, Wei; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2014) -
Compact thermal modeling of hot spots in advanced 3D-stacked structures
Torregiani, Cristina; Oprins, Herman; Vandevelde, Bart; Beyne, Eric; De Wolf, Ingrid (2009) -
Compact transient thermal models for the polymer stud grid array (PSGATM) package
Christiaens, Filip; Beyne, Eric; Vandevelde, Bart; Roggen, Jean; Mertens, Robert; Van Puymbroeck, Jef; Heerman, M.; Berghmans, J. (1997) -
Comparison of experimental methods for the extraction of the elastic modulus of molding compounds used in IC packaging
Ivankovic, Andrej; Vanstreels, Kris; Vanderstraeten, Daniel; Brizar, Guy; Gillon, Renaud; Blansaer, Eddy; Vandevelde, Bart (2012) -
Comparison of x-ray diffraction, wafer curvature and Raman spectroscopy to evaluate the stress evolution in Copper TSV's
Wilson, Chris; De Wolf, Ingrid; Vandevelde, Bart; De Messemaeker, Joke; Ablett, James M.; Redolfi, Augusto; Simons, Veerle; Beyne, Eric; Croes, Kristof (2012) -
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Oprins, Herman; Danneels, Johan; Van Ham, Brecht; Vandevelde, Bart; Baelmans, Martine (2007-01) -
Convection heat transfer in electrostatic actuated liquid droplets for electronics cooling
Oprins, Herman; Danneels, Johan; Van Ham, Brecht; Vandevelde, Bart; Baelmans, Martine (2008-07) -
Cooling of microelectronics using electrostatic actuated liquid droplets
Oprins, Herman; Vandevelde, Bart; Baelmans, Martine (2007) -
Crack growth rate measurement and analysis for WLCSP Sn-Ag-Cu solder joints
Limaye, Paresh; Vandevelde, Bart; Verlinden, Bert; Vandepitte, Dirk (2005-09) -
Creep behavior of mixed SAC 405/ SnPb soldered assemblies in shear loading
Limaye, Paresh; Labie, Riet; Vandevelde, Bart; Vandepitte, Dirk; Verlinden, Bert (2007) -
Cross-section nano-indentation for rapid adhesion evaluation
Brongersma, Sywert; Degryse, Dominiek; Souiller, Jérôme; Vandevelde, Bart; Maex, Karen (2004) -
Cu bonding to Cu low K wafers: a systematic study of the mechanical bonding process
Degryse, Dominiek; Vandevelde, Bart; Beyne, Eric (2005) -
Cu pumping in TSVs: Effect of pre-CMP thermal budget
De Wolf, Ingrid; Croes, Kristof; Varela Pedreira, Olalla; Labie, Riet; Redolfi, Augusto; Van De Peer, Myriam; Vanstreels, Kris; Okoro, Chukwudi; Vandevelde, Bart; Beyne, Eric (2011) -
Das Stud-Grid-Array - eine kostengünstige Lösung für den Einbau vielpoliger ICs
Beyne, Eric; Christiaens, Filip; Vandevelde, Bart; Roggen, Jean; Van Puymbroeck, J.; Dumoulin, A.; Boone, L.; Meerman, H. (1996) -
Dealing with IC package material and design uncertainties using FUZZY finite elements
Vandevelde, Bart; Konstantinou, Ionnas; Moens, David; Vandepitte, Dirk (2013) -
Defect-free isolation on high-thermal-conductivity SOI substrates for complementary BiCMOS technology
Van Wichelen, Koen; Ong, Patrick; Moussa, Alain; Radisic, Dunja; Devriendt, Katia; Halder, Sandip; Kenis, Karine; Lee, Willie; Vandevelde, Bart; Soonekindt, Christophe; Shahar, Abdul Hadi; Smet, Tom; Van Huylenbroeck, Stefaan; Decoutere, Stefaan; Seacrist, Mike; Ries, Mike; Drobny, Vladimir; Wise, Rick (2009) -
Deformation analysis of QFN packages for validation of thermo-mechanical finite element simulations
Nawghane, Chinmay; Moncond'huy, Thomas; Vandevelde, Bart; Vernhes, Pierre; Cruz, Rodolfo (2023)