Browsing by author "Vandevelde, Bart"
Now showing items 21-40 of 280
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Analytical and finite element models of the thermal behavior for lead-free soldering processes in electronic assembly
Van Steenberge, Nele; Limaye, Paresh; Willems, Geert; Vandevelde, Bart; Schildermans, Inge (2007) -
Analytical and finite element models of the thermal behaviour for lead-free soldering processes in electronic assembly
Van Steenberge, Nele; Vandevelde, Bart; Schildermans, Inge; Willems, Geert (2005-04) -
Analytical thermo-mechanical model for non-underfilled area array flip chip assemblies
Vandevelde, Bart; Beyne, Eric; Vandepitte, D.; Baelmans, M. (2004-09) -
Artificial Neural Network Regressor for Parametric Solder Strain Models for BGAs
Ferrando Villalba, Pablo; Nawghane, Chinmay; Vandevelde, Bart (2020) -
Assessment of the feasibility of 'multiple chips-to-wafer' thermo-compression bonding using FEM
Okoro, Chukwudi; Jourdain, Anne; Vandevelde, Bart; Swinnen, Bart; Vandepitte, Dirk (2008) -
B-spline X-ray diffraction imaging – rapid non-destructive measurement of die warpage in ball grid array packages
Cowley, A.; Ivankovic, A.; Wong, C.S; Bennett, N.S.; Danilewsky, A.N.; Gonzalez, Mario; Cherman, Vladimir; Vandevelde, Bart; De Wolf, Ingrid; McNally, P.J. (2016) -
Basic research on solder joint
Vandevelde, Bart (2011) -
BGA solder strain prediction using an Artificial Neural Network regressor
Ferrando Villalba, Pablo; Vandevelde, Bart (2020) -
BGA solder strain prediction using an Artificial Neural Network regressor
Ferrando Villalba, Pablo; Vandevelde, Bart (2022) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2003-12) -
Bleifrei in die Gehäusezukunft
Parton, Els; Gonzalez, Mario; Labie, Riet; Vandevelde, Bart; Vanfleteren, Jan; Ratchev, Petar (2004) -
Board-level solder intermetallic strength measurements using mini-Charpy shock testing and FEM calibration
Labie, Riet; Duflos, Frederic; Vandevelde, Bart; Allaert, Bart; Lauwaert, Ralph; Willems, Geert (2018) -
Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
Degryse, Dominiek; Labie, Riet; Vandevelde, Bart; Gonzalez, M.; Beyne, Eric (2002) -
Brittle to ductile fracture transition in bulk Pb-free solders
Ratchev, Petar; Vandevelde, Bart; Verlinden, B.; Allaert, B.; Werkhoven, D. (2007) -
Challenges for structural stability of ultra-low-k based interconnects
Iacopi, Francesca; Brongersma, Sywert; Vandevelde, Bart; Travaly, Youssef; Maex, Karen (2004) -
Challenges in BEOL design and materials coping with CPI stress issues for advanced packaging solutions
Vandevelde, Bart; Ivankovic, Andrej; Debecker, Bjorn; Lofrano, Melina; Vanstreels, Kris; Cherman, Vladimir; Gonzalez, Mario; Van der Plas, Geert; De Wolf, Ingrid; Beyne, Eric; Tokei, Zsolt (2013) -
Challenges in introducing high-density interconnect technology in printed circuit boards for space applications
Cauwe, Maarten; Vandevelde, Bart; Nawghane, Chinmay; Van de Slyeke, Marnix; Coulon, Alexia; Heltzel, Stan (2023) -
Characterisation of the Polymer Stud Grid Array (PSGA), a lead-free CSP for high performance and high reliable packaging
Vandevelde, Bart; Driessens, Evelien; Chandrasekhar, Arun; Beyne, Eric; Van Puymbroeck, Jan; Heerman, M. (2001) -
Characterization and FE analysis on the shear test of electronic materials
Gonzalez, Mario; Vandevelde, Bart; Van Hoof, Rita; Beyne, Eric (2004-12) -
Characterization of the thermal impact of Cu-Cu bonds achieved using TSVs on hot spot dissipation in 3D stacked ICs
Oprins, Herman; Cherman, Vladimir; Vandevelde, Bart; Torregiani, Cristina; Stucchi, Michele; Van der Plas, Geert; Marchal, Pol; Beyne, Eric (2011-05)