Publication:
Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
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1 since deposited on 2021-10-14
Acq. date: 2026-01-09
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2117 since deposited on 2021-10-14
Acq. date: 2026-01-09
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1 since deposited on 2021-10-14
Acq. date: 2026-01-09
Views
2117 since deposited on 2021-10-14
Acq. date: 2026-01-09
Citations