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Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
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Authors
Degryse, Dominiek
;
Labie, Riet
;
Vandevelde, Bart
;
Gonzalez, M.
;
Beyne, Eric
Conference
Proceedings of the 3rd Eurosime Conference
Title
Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures
Publication type
Proceedings paper
Embargo date
9999-12-31
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