Publication:

Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

Date

2002
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorDegryse, Dominiek
dc.contributor.authorLabie, Riet
dc.contributor.authorVandevelde, Bart
dc.contributor.authorGonzalez, M.
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorLabie, Riet
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecLabie, Riet::0000-0002-1401-1291
dc.contributor.orcidimecVandevelde, Bart::0000-0002-6753-6438
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T21:27:42Z
dc.date.available2021-10-14T21:27:42Z
dc.date.embargo9999-12-31
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6246
dc.source.beginpage316
dc.source.conferenceProceedings of the 3rd Eurosime Conference
dc.source.conferencedate14/04/2002
dc.source.conferencelocationParis France
dc.source.endpage321
dc.title

Bond pad pitch reduction down to 40 μm: influence on solder joint fatigue for flip chip structures

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
5993.pdf
Size:
709.98 KB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions