Browsing by author "Civale, Yann"
Now showing items 41-43 of 43
-
Via-last airgap liner TSV for ultra-low capacitance applications
Civale, Yann; Gonzalez, Mario; Sabuncuoglu Tezcan, Deniz; Travaly, Youssef; Soussan, Philippe; Beyne, Eric (2010) -
Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance
Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric (2013) -
Void-free filling of HAR TSVs using a wet alkaline Cu seed on CVD Co as a replacement for PVD Cu seed
Armini, Silvia; El-Mekki, Zaid; Vandersmissen, Kevin; Philipsen, Harold; Rodet, Simon; Honore, Mia; Radisic, Alex; Civale, Yann; Beyne, Eric; Leunissen, Peter (2011)