Via-last airgap liner TSV for ultra-low capacitance applications

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Authors
Civale, Yann; Gonzalez, Mario; Sabuncuoglu Tezcan, Deniz; Travaly, Youssef; Soussan, Philippe; Beyne, Eric
Conference
IEEE International 3D Systems Integration Conference - 3DIC
Title
Via-last airgap liner TSV for ultra-low capacitance applications
Publication type
Proceedings paper
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