Publication:

Via-last airgap liner TSV for ultra-low capacitance applications

Date

2010
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCivale, Yann
dc.contributor.authorGonzalez, Mario
dc.contributor.authorSabuncuoglu Tezcan, Deniz
dc.contributor.authorTravaly, Youssef
dc.contributor.authorSoussan, Philippe
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorGonzalez, Mario
dc.contributor.imecauthorSabuncuoglu Tezcan, Deniz
dc.contributor.imecauthorSoussan, Philippe
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecSabuncuoglu Tezcan, Deniz::0000-0002-9237-7862
dc.contributor.orcidimecSoussan, Philippe::0000-0002-1347-6978
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.contributor.orcidimecGonzalez, Mario::0000-0003-4374-4854
dc.date.accessioned2021-10-18T15:36:37Z
dc.date.available2021-10-18T15:36:37Z
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/16875
dc.source.conferenceIEEE International 3D Systems Integration Conference - 3DIC
dc.source.conferencedate16/11/2010
dc.source.conferencelocationMünchen Germany
dc.title

Via-last airgap liner TSV for ultra-low capacitance applications

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections:
Conference contributions