Authors

Civale, Yann; Van Huylenbroeck, Stefaan; Redolfi, Augusto; Guo, Wei; Babaei Gavan, Khashayar; Jaenen, Patrick; La Manna, Antonio; Beyer, Gerald; Swinnen, Bart; Beyne, Eric

Conference

63rd Electronic Components and Technology Conference - ECTC

Title

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

Publication type

Proceedings paper

Embargo date

9999-12-31