Publication:

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

Date

2013
Proceedings Paper
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Author(s)

Civale, Yann
;
Van Huylenbroeck, Stefaan  
;
Redolfi, Augusto  
;
Guo, Wei  
;
Babaei Gavan, Khashayar  
;
Jaenen, Patrick  
;
La Manna, Antonio  
;
Beyer, Gerald  
;
Swinnen, Bart  
;
Beyne, Eric  

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1981 since deposited on 2021-10-21
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Acq. date: 2026-08-20

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