Publication:

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

Date

2013
Proceedings Paper
Simple item page Full metadata Statistics
 
dc.contributor.authorCivale, Yann
dc.contributor.authorVan Huylenbroeck, Stefaan
dc.contributor.authorRedolfi, Augusto
dc.contributor.authorGuo, Wei
dc.contributor.authorBabaei Gavan, Khashayar
dc.contributor.authorJaenen, Patrick
dc.contributor.authorLa Manna, Antonio
dc.contributor.authorBeyer, Gerald
dc.contributor.authorSwinnen, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVan Huylenbroeck, Stefaan
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.imecauthorGuo, Wei
dc.contributor.imecauthorBabaei Gavan, Khashayar
dc.contributor.imecauthorJaenen, Patrick
dc.contributor.imecauthorLa Manna, Antonio
dc.contributor.imecauthorBeyer, Gerald
dc.contributor.imecauthorSwinnen, Bart
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecVan Huylenbroeck, Stefaan::0000-0001-9978-3575
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-21T06:59:49Z
dc.date.available2021-10-21T06:59:49Z
dc.date.embargo9999-12-31
dc.date.issued2013
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/22153
dc.source.beginpage1420
dc.source.conference63rd Electronic Components and Technology Conference - ECTC
dc.source.conferencedate28/05/2013
dc.source.conferencelocationLas Vegas, NV USA
dc.source.endpage1424
dc.title

Via-middle through-silicon via with integrated airgap to zero TSV-induced stress impact on device performance

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
25487.pdf
Size:
2.59 MB
Format:
Adobe Portable Document Format
Download
Publication available in collections:
Conference contributions