Publication:

Chip-to-chip optical wireless link feasibility using optical phased arrays on silicon-on-insulator

Date

 
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0001-8139-2736
cris.virtual.orcid0000-0003-1266-1319
cris.virtualsource.department4f3bafc0-97c3-414b-8855-032c48c1188f
cris.virtualsource.department320b6e8f-da53-4221-a48d-cd95ae93e218
cris.virtualsource.orcid4f3bafc0-97c3-414b-8855-032c48c1188f
cris.virtualsource.orcid320b6e8f-da53-4221-a48d-cd95ae93e218
dc.contributor.authorVan Acoleyen, Karel
dc.contributor.authorBaets, Roel
dc.contributor.authorRogier, Hendrik
dc.contributor.imecauthorBaets, Roel
dc.contributor.imecauthorRogier, Hendrik
dc.contributor.orcidimecBaets, Roel::0000-0003-1266-1319
dc.contributor.orcidimecRogier, Hendrik::0000-0001-8139-2736
dc.date.accessioned2021-10-18T22:43:38Z
dc.date.available2021-10-18T22:43:38Z
dc.date.embargo9999-12-31
dc.date.issued2010
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/18136
dc.source.beginpage243
dc.source.conference7th IEEE International Conference on Group IV Photonics
dc.source.conferencedate1/09/2010
dc.source.conferencelocationBeijing China
dc.source.endpage245
dc.title

Chip-to-chip optical wireless link feasibility using optical phased arrays on silicon-on-insulator

dc.typeProceedings paper
dspace.entity.typePublication
Files

Original bundle

Name:
21359.pdf
Size:
333.79 KB
Format:
Adobe Portable Document Format
Publication available in collections: