Publication:

A combined modelling approach to design test structures to study thermomigration in Cu interconnects

Date

2022
Journal article
https://doi.org/10.1016/j.microrel.2022.114632
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dc.contributor.authorDing, Youqi
dc.contributor.authorLofrano, Melina
dc.contributor.authorVarela Pedreira, Olalla
dc.contributor.authorZahedmanesh, Houman
dc.contributor.authorCroes, Kristof
dc.contributor.authorDe Wolf, Ingrid
dc.contributor.imecauthorDing, Youqi
dc.contributor.imecauthorLofrano, Melina
dc.contributor.imecauthorVarela Pedreira, Olalla
dc.contributor.imecauthorZahedmanesh, Houman
dc.contributor.imecauthorCroes, Kristof
dc.contributor.imecauthorDe Wolf, Ingrid
dc.contributor.orcidimecVarela Pedreira, Olalla::0000-0002-2987-1972
dc.contributor.orcidimecZahedmanesh, Houman::0000-0002-0290-691X
dc.contributor.orcidimecCroes, Kristof::0000-0002-3955-0638
dc.contributor.orcidimecDe Wolf, Ingrid::0000-0003-3822-5953
dc.date.accessioned2023-03-02T13:40:29Z
dc.date.available2022-12-30T03:10:10Z
dc.date.available2023-03-02T13:40:29Z
dc.date.issued2022
dc.identifier.doi10.1016/j.microrel.2022.114632
dc.identifier.issn0026-2714
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/40920
dc.publisherPERGAMON-ELSEVIER SCIENCE LTD
dc.source.beginpage114632
dc.source.endpagena
dc.source.issuena
dc.source.journalMICROELECTRONICS RELIABILITY
dc.source.numberofpages9
dc.source.volume138
dc.title

A combined modelling approach to design test structures to study thermomigration in Cu interconnects

dc.typeJournal article
dspace.entity.typePublication
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