Publication:

Impact of thermal budget on junction leakage in a 0.18 μm and 0.13 μm CMOS technology

Date

 
dc.contributor.authorPoyai, Amporn
dc.contributor.authorSimoen, Eddy
dc.contributor.authorClaeys, Cor
dc.contributor.authorRooyackers, Rita
dc.contributor.authorRedolfi, Augusto
dc.contributor.imecauthorSimoen, Eddy
dc.contributor.imecauthorRedolfi, Augusto
dc.contributor.orcidimecSimoen, Eddy::0000-0002-5218-4046
dc.date.accessioned2021-10-14T22:52:22Z
dc.date.available2021-10-14T22:52:22Z
dc.date.issued2002
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/6743
dc.source.beginpage213
dc.source.conferenceProceedings of the 17th International Symposium on Microelectronics Technology and Devices - SBMICRO
dc.source.conferencedate9/09/2002
dc.source.conferencelocationPorto Allegre Brazil
dc.source.endpage222
dc.title

Impact of thermal budget on junction leakage in a 0.18 μm and 0.13 μm CMOS technology

dc.typeProceedings paper
dspace.entity.typePublication
Files
Publication available in collections: