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Presentations
Challenges and emerging solutions in testing 2.5D- and 3D-stacked ICs
Publication:
Challenges and emerging solutions in testing 2.5D- and 3D-stacked ICs
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Date
2013
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APA
Chicago
Harvard
IEEE
Basic data
APA
Chicago
Harvard
IEEE
Author(s)
Marinissen, Erik Jan
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Abstract
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1851
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations
Metrics
Views
1851
since deposited on 2021-10-21
Acq. date: 2025-12-15
Citations