Publication:

Chip-package codesign of a low-power 5-GHz RF front end

Date

2000
Journal article
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dc.contributor.authorDonnay, Stephane
dc.contributor.authorPieters, Philip
dc.contributor.authorVaesen, Kristof
dc.contributor.authorDiels, Wim
dc.contributor.authorWambacq, P.
dc.contributor.authorDe Raedt, Walter
dc.contributor.authorBeyne, Eric
dc.contributor.authorEngels, Marc
dc.contributor.authorBolsens, Ivo
dc.contributor.imecauthorDonnay, Stephane
dc.contributor.imecauthorPieters, Philip
dc.contributor.imecauthorVaesen, Kristof
dc.contributor.imecauthorDe Raedt, Walter
dc.contributor.imecauthorBeyne, Eric
dc.contributor.orcidimecDonnay, Stephane::0000-0003-2489-4793
dc.contributor.orcidimecVaesen, Kristof::0000-0001-9971-3593
dc.contributor.orcidimecDe Raedt, Walter::0000-0002-7117-7976
dc.contributor.orcidimecBeyne, Eric::0000-0002-3096-050X
dc.date.accessioned2021-10-14T12:55:37Z
dc.date.available2021-10-14T12:55:37Z
dc.date.embargo9999-12-31
dc.date.issued2000
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/4347
dc.source.beginpage1583
dc.source.endpage1598
dc.source.issue10
dc.source.journalProceedings of the IEEE
dc.source.volume88
dc.title

Chip-package codesign of a low-power 5-GHz RF front end

dc.typeJournal article
dspace.entity.typePublication
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