Publication:

Introducing a Thermal-Based Method for Measuring Dynamic Thin Film Thickness in Real Time as a Tool for Sensing Applications

Date

2021
Journal article
https://doi.org/10.1109/TIM.2020.3033444
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dc.contributor.authorOudebrouckx, Gilles
dc.contributor.authorThoelen, Ronald
dc.contributor.authorWagner, Patrick
dc.contributor.authorVandenryt, Thys
dc.contributor.authorNivelle, Philippe
dc.contributor.authorBormans, Seppe
dc.contributor.imecauthorOudebrouckx, Gilles
dc.contributor.imecauthorThoelen, Ronald
dc.contributor.imecauthorVandenryt, Thys
dc.contributor.imecauthorNivelle, Philippe
dc.contributor.imecauthorBormans, Seppe
dc.contributor.orcidextWagner, Patrick::0000-0002-4028-3629
dc.contributor.orcidimecOudebrouckx, Gilles::0000-0001-6278-3547
dc.contributor.orcidimecNivelle, Philippe::0000-0002-7788-644X
dc.contributor.orcidimecBormans, Seppe::0000-0002-9890-917X
dc.contributor.orcidimecThoelen, Ronald::0000-0001-6845-0866
dc.date.accessioned2022-02-24T15:40:47Z
dc.date.available2022-02-24T15:40:47Z
dc.date.issued2021
dc.identifier.doi10.1109/TIM.2020.3033444
dc.identifier.issn0018-9456
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/39120
dc.publisherIEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
dc.source.beginpage9503710
dc.source.issuena
dc.source.journalIEEE TRANSACTIONS ON INSTRUMENTATION AND MEASUREMENT
dc.source.numberofpages10
dc.source.volume70
dc.subject.keywordsPLANE SOURCE METHOD
dc.subject.keywordsCONDUCTIVITY
dc.subject.keywordsBIOFILM
dc.subject.keywordsDIFFUSIVITY
dc.subject.keywordsHEAT
dc.subject.keywordsSUSCEPTIBILITY
dc.subject.keywordsLIQUID
dc.subject.keywordsSENSOR
dc.title

Introducing a Thermal-Based Method for Measuring Dynamic Thin Film Thickness in Real Time as a Tool for Sensing Applications

dc.typeJournal article
dspace.entity.typePublication
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