Publication:
CIMID, A technology for high density integration of electronic systems
Date
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.department | #PLACEHOLDER_PARENT_METADATA_VALUE# | |
| cris.virtual.orcid | 0000-0002-3096-050X | |
| cris.virtual.orcid | 0009-0004-1892-7696 | |
| cris.virtual.orcid | 0009-0000-9548-3356 | |
| cris.virtualsource.department | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.department | 493aa219-8dad-4082-b428-93e01387fef1 | |
| cris.virtualsource.department | d575de7f-2d23-4229-888e-79fe5adb4164 | |
| cris.virtualsource.orcid | 67066e7b-3582-42ef-b040-694dc2e501ae | |
| cris.virtualsource.orcid | 493aa219-8dad-4082-b428-93e01387fef1 | |
| cris.virtualsource.orcid | d575de7f-2d23-4229-888e-79fe5adb4164 | |
| dc.contributor.author | Beyne, Eric | |
| dc.contributor.author | Van Hoof, Rita | |
| dc.contributor.author | Christiaens, Filip | |
| dc.contributor.author | Roggen, Jean | |
| dc.contributor.author | Van Puymbroeck, Jan | |
| dc.contributor.author | Heermann, M. | |
| dc.contributor.author | Gouwy, G. | |
| dc.contributor.author | Bulcke, P. | |
| dc.contributor.imecauthor | Beyne, Eric | |
| dc.contributor.imecauthor | Van Hoof, Rita | |
| dc.contributor.imecauthor | Van Puymbroeck, Jan | |
| dc.date.accessioned | 2021-09-29T12:39:51Z | |
| dc.date.available | 2021-09-29T12:39:51Z | |
| dc.date.embargo | 9999-12-31 | |
| dc.date.issued | 1994 | |
| dc.identifier.uri | https://imec-publications.be/handle/20.500.12860/47 | |
| dc.source.beginpage | 226 | |
| dc.source.conference | Proceedings of 27th International Symposium on Microelectronics - ISHM'94 | |
| dc.source.conferencedate | 15/11/1994 | |
| dc.source.conferencelocation | Boston, MA USA | |
| dc.source.endpage | 231 | |
| dc.title | CIMID, A technology for high density integration of electronic systems | |
| dc.type | Proceedings paper | |
| dspace.entity.type | Publication | |
| Files | Original bundle
| |
| Publication available in collections: |