Publication:

3D integration of ultra-thin functional devices inside standard multilayer flex laminates

Date

2009
Proceedings Paper
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cris.virtual.orcid0000-0002-4645-3326
cris.virtual.orcid0000-0002-1302-3346
cris.virtual.orcid0000-0002-9654-7304
cris.virtualsource.department167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.department57e85479-0a90-4281-b019-97f60eb073dc
cris.virtualsource.department44a3a82b-55ff-4186-b5db-5e0130b85450
cris.virtualsource.orcid167f3fe9-5a33-4143-92b1-a1c815093eba
cris.virtualsource.orcid57e85479-0a90-4281-b019-97f60eb073dc
cris.virtualsource.orcid44a3a82b-55ff-4186-b5db-5e0130b85450
dc.contributor.authorChristiaens, Wim
dc.contributor.authorTorfs, Tom
dc.contributor.authorHuwel, W.
dc.contributor.authorVan Hoof, Chris
dc.contributor.authorVanfleteren, Jan
dc.contributor.imecauthorTorfs, Tom
dc.contributor.imecauthorVan Hoof, Chris
dc.contributor.imecauthorVanfleteren, Jan
dc.contributor.orcidimecTorfs, Tom::0000-0002-1302-3346
dc.contributor.orcidimecVanfleteren, Jan::0000-0002-9654-7304
dc.date.accessioned2021-10-17T21:35:22Z
dc.date.available2021-10-17T21:35:22Z
dc.date.embargo9999-12-31
dc.date.issued2009
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/15096
dc.source.conference17th European Microelectronics and Packaging Conference & Exhibition - EMPC
dc.source.conferencedate15/06/2009
dc.source.conferencelocationRimini Italy
dc.title

3D integration of ultra-thin functional devices inside standard multilayer flex laminates

dc.typeProceedings paper
dspace.entity.typePublication
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