Publication:

Thermal cycling reliability analysis for redistributed flip chip assemblies

Date

1998
Presentation
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cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.department#PLACEHOLDER_PARENT_METADATA_VALUE#
cris.virtual.orcid0000-0002-3096-050X
cris.virtual.orcid0000-0002-6753-6438
cris.virtualsource.department67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.department0aefe159-9129-4bab-908e-3a73693ee2e4
cris.virtualsource.orcid67066e7b-3582-42ef-b040-694dc2e501ae
cris.virtualsource.orcid0aefe159-9129-4bab-908e-3a73693ee2e4
dc.contributor.authorVandevelde, Bart
dc.contributor.authorBeyne, Eric
dc.contributor.imecauthorVandevelde, Bart
dc.contributor.imecauthorBeyne, Eric
dc.date.accessioned2021-10-01T09:30:17Z
dc.date.available2021-10-01T09:30:17Z
dc.date.embargo9999-12-31
dc.date.issued1998
dc.identifier.urihttps://imec-publications.be/handle/20.500.12860/3092
dc.source.conferenceIEEE Workshop on VLSI and Microsystems Packaging Techniques and Manufacturing Technologies
dc.source.conferencedate4/05/1998
dc.source.conferencelocationBrugge Belgium
dc.title

Thermal cycling reliability analysis for redistributed flip chip assemblies

dc.typeOral presentation
dspace.entity.typePublication
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